Canfield TechnologiesUnited States
SAC 305 NO CLEAN FLUX 1 LB .062
All alternatives
View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Spool |
| Storage/Refrigeration Temperature | 50°F ~ 104°F (10°C ~ 40°C) |
| Other | |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | 0.062" (1.57mm) |
| Flux Type | No-Clean |
| Form | Spool, 1 lb (454 g) |
| Melting Point | 423 ~ 424°F (217 ~ 218°C) |
| Mfr | Canfield Technologies |
| Process | Lead Free |
| Product Status | Active |
| Series | - |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | - |
| Type | Wire Solder |
| Weight | - |
| Wire Gauge | 14 AWG, 16 SWG |
Documents
No documents are linked to this part yet.