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Technical parameters

Key specs

CoreH8S
Core size16 bit
Speed20 MHzMax
Flash160 kB
RAM8 kB
I/O count112
Supply voltage3 ~ 3.6 V
Power
Voltage - Supply (Vcc/Vdd)3V ~ 3.6V
Environment and package
Core Size16-Bit
EEPROM Size-
Mounting TypeSurface Mount
Operating Temperature-20°C ~ 75°C (TA)
PackageTray
Package / Case144-TQFP
Program Memory Size160KB (160K x 8)
RAM Size8K x 8
Supplier Device Package144-TQFP (16x16)
Other
Base Product NumberDF2117
ConnectivityFIFO, I²C, LPC, SCI, SmartCard
Core ProcessorH8S/2600
Data ConvertersA/D 16x10b
DigiKey ProgrammableNot Verified
MfrRenesas Electronics Corporation
Number of I/O112
Oscillator TypeExternal
PeripheralsPOR, PWM, WDT
Product StatusNot For New Designs
Program Memory TypeFLASH
SeriesH8® H8S/2100
Speed20MHz

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