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Technical parameters

Key specs

CoreH8S
Core size16 bit
Speed20 MHzMax
Flash384 kB
RAM32 kB
I/O count72
Supply voltage2.7 ~ 3.6 V
Power
Voltage - Supply (Vcc/Vdd)2.7V ~ 3.6V
Environment and package
Core Size16-Bit
EEPROM Size-
Mounting TypeSurface Mount
Operating Temperature-20°C ~ 75°C (TA)
PackageTray
Package / Case100-BFQFP
Program Memory Size384KB (384K x 8)
RAM Size32K x 8
Supplier Device Package100-QFP (14x14)
Other
Base Product NumberDF2239
ConnectivityI²C, SCI, SmartCard
Core ProcessorH8S/2000
Data ConvertersA/D 8x10b; D/A 2x8b
DigiKey ProgrammableNot Verified
MfrRenesas Electronics Corporation
Number of I/O72
Oscillator TypeInternal
PeripheralsDMA, POR, PWM, WDT
Product StatusActive
Program Memory TypeFLASH
SeriesH8® H8S/2200
Speed20MHz

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