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Technical parameters

Key specs

CoreH8S
Core size16 bit
Speed25 MHzMax
Flash256 kB
RAM8 kB
I/O count70
Supply voltage2.7 ~ 3.6 V
Power
Voltage - Supply (Vcc/Vdd)2.7V ~ 3.6V
Environment and package
Core Size16-Bit
EEPROM Size-
Mounting TypeSurface Mount
Operating Temperature-20°C ~ 75°C (TA)
PackageTray
Package / Case100-BQFP
Program Memory Size256KB (256K x 8)
RAM Size8K x 8
Supplier Device Package100-QFP (14x20)
Other
Base Product NumberDF2318
ConnectivitySCI, SmartCard
Core ProcessorH8S/2000
Data ConvertersA/D 8x10b; D/A 2x8b
DigiKey ProgrammableNot Verified
MfrRenesas Electronics Corporation
Number of I/O70
Oscillator TypeInternal
PeripheralsPOR, PWM, WDT
Product StatusActive
Program Memory TypeFLASH
SeriesH8® H8S/2300
Speed25MHz

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