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Technical parameters

Key specs

CoreH8S
Core size16 bit
Speed33 MHzMax
Flash384 kB
RAM30 kB
I/O count96
Supply voltage3 ~ 3.6 V
Power
Voltage - Supply (Vcc/Vdd)3V ~ 3.6V
Environment and package
Core Size16-Bit
EEPROM Size-
Mounting TypeSurface Mount
Operating Temperature-20°C ~ 75°C (TA)
PackageTray
Package / Case144-LQFP
Program Memory Size384KB (384K x 8)
RAM Size30K x 8
Supplier Device Package144-LQFP (20x20)
Other
Base Product NumberDF2376
ConnectivityI²C, IrDA, SCI, SmartCard
Core ProcessorH8S/2000
Data ConvertersA/D 16x10b; D/A 6x8b
DigiKey ProgrammableNot Verified
MfrRenesas Electronics Corporation
Number of I/O96
Oscillator TypeExternal
PeripheralsDMA, POR, PWM, WDT
Product StatusObsolete
Program Memory TypeFLASH
SeriesH8® H8S/2300
Speed33MHz

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