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Technical parameters

Key specs

CoreH8S
Core size16 bit
Speed20 MHzMax
Flash256 kB
RAM16 kB
I/O count85
Supply voltage3 ~ 3.6 V
Power
Voltage - Supply (Vcc/Vdd)3V ~ 3.6V
Environment and package
Core Size16-Bit
EEPROM Size-
Mounting TypeSurface Mount
Operating Temperature-20°C ~ 75°C (TA)
PackageTray
Package / Case128-BFQFP
Program Memory Size256KB (256K x 8)
RAM Size16K x 8
Supplier Device Package128-QFP (14x20)
Other
Base Product NumberDF2437
ConnectivityI²C, SCI
Core ProcessorH8S/2600
Data ConvertersA/D 16x10b
DigiKey ProgrammableNot Verified
MfrRenesas Electronics Corporation
Number of I/O85
Oscillator TypeInternal
PeripheralsPOR, PWM, WDT
Product StatusActive
Program Memory TypeFLASH
SeriesH8® H8S/2400
Speed20MHz

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