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Technical parameters

Key specs

CoreH8
Core size16 bit
Speed25 MHzMax
Flash512 kB
RAM16 kB
I/O count70
Supply voltage3 ~ 3.6 V
Power
Voltage - Supply (Vcc/Vdd)3V ~ 3.6V
Environment and package
Core Size16-Bit
EEPROM Size-
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 85°C (TA)
PackageTray
Package / Case100-BFQFP
Program Memory Size512KB (512K x 8)
RAM Size16K x 8
Supplier Device Package100-QFP (14x14)
Other
Base Product NumberDF3029
ConnectivitySCI, SmartCard
Core ProcessorH8/300H
Data ConvertersA/D 8x10b; D/A 2x8b
DigiKey ProgrammableNot Verified
MfrRenesas Electronics Corporation
Number of I/O70
Oscillator TypeInternal
PeripheralsDMA, PWM, WDT
Product StatusActive
Program Memory TypeFLASH
SeriesH8® H8/300H
Speed25MHz

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