CR TechnologyUnited States
Silicone-Free Thermal Pad
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Sheet |
| Storage/Refrigeration Temperature | - |
| Thermal Conductivity | 1.0W/m-K |
| Thermal Resistivity | 1.1°C/W |
| Other | |
| Adhesive | - |
| Backing, Carrier | - |
| Color | White |
| Digi-Key Storage | - |
| Material | Non-Silicone |
| Mfr | CR Technology |
| Outline | 200.00mm x 300.00mm |
| Product Status | Active |
| Series | EVAF |
| Shape | - |
| Shelf Life | - |
| Shelf Life Start | - |
| Thickness | 0.0190" (0.500mm) |
| Type | Thermal Pad |
| Usage | Multi |