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Technical parameters

Power
Power Per Element62.5mW
Environment and package
Height - Seated (Max)0.106" (2.69mm)
Mounting TypeSurface Mount
Operating Temperature-55°C ~ 125°C
PackageCut Tape (CT)
Package / Case10-SSIP
Size / Dimension0.529" L x 0.087" W (13.43mm x 2.20mm)
Supplier Device Package10-SIP
Temperature Coefficient±200ppm/°C
Other
Applications-
Base Product NumberEXB-H10
Circuit TypeBussed
MfrPanasonic Electronic Components
Number of Pins10
Number of Resistors9
Product StatusObsolete
Resistance (Ohms)150
Resistor Matching Ratio-
Resistor-Ratio-Drift-
SeriesEXB
Tolerance±5%

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