JAE ElectronicsJapan
CONN RCPT 30P 0.016 GOLD SMD R/A
All alternatives
View full reportTechnical parameters
Key specs
Positions30
Rows1
Pitch400 µm
GenderFemale
| Power | |
|---|---|
| Current Rating (Amps) | - |
| Voltage Rating | - |
| Environment and package | |
| Insulation Height | 0.039" (1.00mm) |
| Mated Stacking Heights | - |
| Mounting Type | Surface Mount, Right Angle |
| Operating Temperature | - |
| Package | Tape & Reel (TR) |
| Other | |
| Applications | - |
| Base Product Number | FI-JH30 |
| Connector Type | Receptacle |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 3.90µin (0.099µm) |
| Contact Finish Thickness - Post | 1.25µin (0.032µm) |
| Contact Length - Post | - |
| Contact Material | Copper Alloy |
| Contact Shape | - |
| Contact Type | Non-Gendered |
| Fastening Type | Friction Lock |
| Features | Solder Retention |
| Ingress Protection | - |
| Insulation Color | - |
| Insulation Material | Plastic |
| Material Flammability Rating | - |
| Mfr | JAE Electronics |
| Number of Positions | 30 |
| Number of Positions Loaded | All |
| Number of Rows | 1 |
| Pitch - Mating | 0.016" (0.40mm) |
| Product Status | Obsolete |
| Row Spacing - Mating | - |
| Series | FI-JH |
| Style | Board to Cable/Wire |
| Termination | Solder |
Documents
No documents are linked to this part yet.