针数30
排数1
间距1 mm
公母母
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针数30
排数1
间距1 mm
公母母
| 电源 | |
|---|---|
| Current Rating (Amps) | - |
| Voltage Rating | - |
| 环境与封装 | |
| Insulation Height | - |
| Mated Stacking Heights | - |
| Mounting Type | Board Edge, Cutout; Bottom Mount, Surface Mount, Right Angle, Reverse Mount |
| Operating Temperature | - |
| Package | Tape & Reel (TR) |
| 其他 | |
| Applications | - |
| Base Product Number | FI-XPB30 |
| Connector Type | Receptacle |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 12.0µin (0.30µm) |
| Contact Finish Thickness - Post | - |
| Contact Length - Post | - |
| Contact Material | Copper Alloy |
| Contact Shape | - |
| Contact Type | Non-Gendered |
| Fastening Type | Friction Lock |
| Features | Grounding Pins, Shielded, Solder Retention |
| Ingress Protection | - |
| Insulation Color | Black |
| Insulation Material | Plastic |
| Material Flammability Rating | UL94 V-0 |
| Mfr | JAE Electronics |
| Number of Positions | 30 |
| Number of Positions Loaded | All |
| Number of Rows | 1 |
| Pitch - Mating | 0.039" (1.00mm) |
| Product Status | Obsolete |
| Row Spacing - Mating | - |
| Series | FI-XP |
| Style | Board to Cable/Wire |
| Termination | Solder |
技术资料
该型号暂未收录资料。