All alternatives

View full report

Technical parameters

Environment and package
Height Above Board-
Mated Stacking Heights-
Mounting Type-
PackageBulk
Other
Connector TypeStacking Compression
Contact Finish-
Contact Finish Thickness-
Features-
MfrSamtec Inc.
Number of Positions-
Pitch-
Product StatusActive
SeriesFSI

Documents

No documents are linked to this part yet.