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Technical parameters

Key specs

Memory typeFlash
Memory size256 Mbit
InterfaceQSPI / OSPI
Supply voltage1.65 ~ 2 V
Power
Voltage - Supply1.65V ~ 2V
Environment and package
Memory Size256Mbit
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 105°C (TA)
PackageTray
Package / Case24-TBGA
Supplier Device Package24-TFBGA (6x8)
Other
Memory FormatFLASH
Memory InterfaceSPI - Octal I/O, DTR
Memory Organization32M x 8
Memory TypeNon-Volatile
MfrGigaDevice Semiconductor (HK) Limited
Product StatusActive
SeriesGD25LX
TechnologyFLASH - NOR (SLC)
Write Cycle Time - Word, Page-

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