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Technical parameters

Environment and package
Mounting Hole Diameter0.070" ~ 0.074" (1.78mm ~ 1.87mm)
Mounting TypeThrough Hole
PackageBulk
Pin Size - Above Flange-
Pin Size - Below Flange0.038" (0.97mm) Dia
Other
Base Product NumberH2103
Board Thickness0.126" (3.20mm)
Contact FinishTin
Contact Finish Thickness-
Contact MaterialBrass
Flange Diameter0.094" (2.39mm)
InsulationNon-Insulated
Insulation Color-
Length - Above Flange-
Length - Below Flange0.395" (10.03mm)
Length - Overall0.415" (10.54mm)
Material - Insulation-
MfrHarwin Inc.
Product StatusActive
Series-
Terminal StyleSingle End
Terminal TypePC Pin
TerminationSolder

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