Enclustra FPGA SolutionsSwitzerland
ACC HEATSINK MA-ZX*/AX3
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Fin Height | - |
| Package | Box |
| Package Cooled | - |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | - |
| Thermal Resistance @ Natural | - |
| Other | |
| Attachment Method | - |
| Diameter | - |
| Length | - |
| Material | - |
| Material Finish | - |
| Mfr | Enclustra FPGA Solutions |
| Product Status | Active |
| Series | - |
| Shape | - |
| Shelf Life | - |
| Type | - |
| Width | - |
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