CUI DevicesСША
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
Все аналоги
Полный отчётТехнические параметры
| Условия эксплуатации и корпус | |
|---|---|
| Fin Height | 0.315" (8.00mm) |
| Package | Box |
| Package Cooled | BGA |
| Power Dissipation @ Temperature Rise | 1.9W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 16.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 39.10°C/W |
| Другое | |
| Attachment Method | Adhesive (Not Included) |
| Diameter | - |
| Length | 0.335" (8.50mm) |
| Material | Aluminum Alloy |
| Material Finish | Black Anodized |
| Mfr | CUI Devices |
| Product Status | Active |
| Series | HSB |
| Shape | Square, Pin Fins |
| Type | Top Mount |
| Width | 0.335" (8.50mm) |