CUI DevicesUnited States
HEAT SINK, BGA, 10 X 10 X 7 MM
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Fin Height | 0.275" (7.00mm) |
| Package | Box |
| Package Cooled | BGA |
| Power Dissipation @ Temperature Rise | 2.0W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 16.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 37.90°C/W |
| Other | |
| Attachment Method | Adhesive (Not Included) |
| Diameter | - |
| Length | 0.394" (10.00mm) |
| Material | Aluminum Alloy |
| Material Finish | Black Anodized |
| Mfr | CUI Devices |
| Product Status | Active |
| Series | HSB |
| Shape | Square, Pin Fins |
| Type | Top Mount |
| Width | 0.394" (10.00mm) |