Chip Quik Inc.United States
POWERSOIC-20/PSOP-20/HSOP-20
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Package Accepted | PowerSOIC, PSOP, HSOP |
| Size / Dimension | 1.000" x 1.200" (25.40mm x 30.48mm) |
| Other | |
| Board Thickness | 0.062" (1.57mm) 1/16" |
| Material | FR4 Epoxy Glass |
| Mfr | Chip Quik Inc. |
| Number of Positions | 20 |
| Pitch | 0.050" (1.27mm) |
| Product Status | Active |
| Proto Board Type | SMD to DIP |
| Series | Proto-Advantage |