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Technical parameters

Environment and package
PackageBulk
Package AcceptedHSOP, PSOP, SOIC
Size / Dimension1.200" L x 0.700" W (30.48mm x 17.78mm)
Other
Board Thickness-
Material-
MfrChip Quik Inc.
Number of Positions24
Pitch0.050" (1.27mm)
Product StatusActive
Proto Board TypeSMD to DIP
SeriesProto-Advantage

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