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Technical parameters

Environment and package
PackageBulk
Package AcceptedHSOP
Size / Dimension1.200" x 1.700" (30.48mm x 43.18mm)
Other
Board Thickness0.062" (1.57mm) 1/16"
MaterialFR4 Epoxy Glass
MfrChip Quik Inc.
Number of Positions30
Pitch0.031" (0.80mm)
Product StatusActive
Proto Board TypeSMD to DIP
SeriesProto-Advantage

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