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Technical parameters

Environment and package
Inner Dimension0.177" L x 0.138" W (4.50mm x 3.50mm)
Outer Dimension1.300" L x 0.900" W (33.02mm x 22.86mm)
PackageBulk
Thermal Center Pad0.156" L x 0.083" W (3.95mm x 2.10mm)
Other
MaterialStainless Steel
MfrChip Quik Inc.
Number of Positions18
Pitch0.016" (0.40mm)
Product StatusActive
SeriesProto-Advantage IPC
Thickness0.0040" (0.102mm)
TypeDFN

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