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Technical parameters

Environment and package
PackageBulk
Package AcceptedSOIC
Size / Dimension1.000" L x 2.200" W (25.40mm x 55.88mm)
Other
Board Thickness0.063" (1.60mm)
MaterialFR4 Epoxy Glass
MfrChip Quik Inc.
Number of Positions44
Pitch0.050" (1.27mm)
Product StatusActive
Proto Board TypeSMD to DIP
SeriesProto-Advantage

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