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Technical parameters

Environment and package
Inner Dimension0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension1.300" L x 0.900" W (33.02mm x 22.86mm)
PackageBulk
Thermal Center Pad0.157" L x 0.157" W (4.00mm x 4.00mm)
Other
MaterialStainless Steel
MfrChip Quik Inc.
Number of Positions48
Pitch0.020" (0.50mm)
Product StatusActive
SeriesProto-Advantage IPC
Thickness0.0040" (0.102mm)
TypeHTQFP

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