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Technical parameters

Environment and package
PackageBulk
Package Accepted-
Size / Dimension3.500" L x 1.000" W (88.90mm x 25.40mm)
Other
Board Thickness0.063" (1.60mm)
MaterialFR4 Epoxy Glass
MfrChip Quik Inc.
Number of Positions70
Pitch0.025" (0.64mm)
Product StatusActive
Proto Board TypeSMD to DIP
Series-

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