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Technical parameters

Environment and package
PackageBulk
Package Accepted-
Size / Dimension1.000" L x 0.400" W (25.40mm x 10.16mm)
Other
Board Thickness0.063" (1.60mm)
MaterialFR4 Epoxy Glass
MfrChip Quik Inc.
Number of Positions8
Pitch0.156" (3.96mm)
Product StatusActive
Proto Board TypeSMD to DIP
Series-

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