Chip Quik Inc.United States
POWERPAK 1212-8 SINGLE TO DIP-8
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Package Accepted | - |
| Size / Dimension | 0.700" L x 0.400" W (17.78mm x 10.16mm) |
| Other | |
| Board Thickness | 0.063" (1.60mm) |
| Material | FR4 Epoxy Glass |
| Mfr | Chip Quik Inc. |
| Number of Positions | 8 |
| Pitch | 0.026" (0.65mm) |
| Product Status | Active |
| Proto Board Type | SMD to DIP |
| Series | - |