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Technical parameters

Environment and package
PackageBulk
Package AcceptedLGA
Size / Dimension1.400" L x 0.700" W (35.56mm x 17.78mm)
Other
Board Thickness0.063" (1.60mm)
MaterialFR4 Epoxy Glass
MfrChip Quik Inc.
Number of Positions28
Pitch0.020" (0.50mm)
Product StatusActive
Proto Board TypeSMD to DIP
Series-

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