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Technical parameters

Key specs

ChannelP-channel
Drain-source voltage-20 VMin: -20 V (VGS = 0V,ID = -250μA)
Continuous drain current-5.3 AMax: -5.3 A (TA = 25°C,VGS = 10V)
On-resistance60 mΩMax · Max: 0.060 Ω (VGS = -10V,ID = -5.3A)
Gate threshold voltage-2.5 VMax · Max: -2.5 V (VDS = VGS,ID = -250μA)

Datasheet-verified parameters

18 items
ParameterValue and test conditionsSource
ChannelP-Channel
Drain-to-Source Breakdown VoltageMin: -20 V (VGS = 0V, ID = -250μA)
Continuous Drain CurrentMax: -5.3 A (TA = 25°C, VGS = 10V)
Static Drain-to-Source On-ResistanceMax: 0.060 Ω (VGS = -10V, ID = -5.3A)
Gate Threshold VoltageMin: -1.0 V, Max: -2.5 V (VDS = VGS, ID = -250μA)
PackageSO-8
Junction and Storage Temperature Range-55 to +150 °C
Market QualificationConsumer market
RoHS ComplianceLead-Free
Pulsed Drain CurrentMax: -21 A
Power DissipationMax: 2.5 W (TC = 25°C)
Gate-to-Source VoltageMax: ± 12 V
Forward TransconductanceTyp: 7.9 S (VDS = -15V, ID = -5.3A)
Drain-to-Source Leakage CurrentMax: -25 μA (VDS = -16V, VGS = 0V)
Total Gate ChargeTyp: 25 nC (ID = -5.3A)
Input CapacitanceTyp: 860 pF (VGS = 0V)
Output CapacitanceTyp: 750 pF (VDS = -10V)
Maximum Junction-to-Ambient Thermal ResistanceMax: 50 °C/W
All parameters (20)ExpandCollapse
Power
Current - Continuous Drain (Id) @ 25°C5.3A (Ta)
Drain to Source Voltage (Vdss)20 V
Drive Voltage (Max Rds On, Min Rds On)4.5V, 10V
Power Dissipation (Max)2.5W (Tc)
Environment and package
Mounting TypeSurface Mount
Operating Temperature-55°C ~ 150°C (TJ)
PackageTube
Package / Case8-SOIC (0.154", 3.90mm Width)
Supplier Device Package8-SO
Other
FET Feature-
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs25 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds860 pF @ 10 V
MfrInfineon Technologies
Product StatusDiscontinued at Digi-Key
Rds On (Max) @ Id, Vgs60mOhm @ 5.3A, 10V
SeriesHEXFET®
TechnologyMOSFET (Metal Oxide)
Vgs (Max)±12V
Vgs(th) (Max) @ Id2.5V @ 250µA

Pinout and package

PackageSO-8

PinNameFunctionSource
1Source
2Source
3Source
4Gate
5Drain
6Drain
7Drain
8Drain

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