全部替代型号

查看完整报告

技术参数

环境与封装
Mounting TypeFixed
PackageRetail Package
其他
Board TypeEvaluation Platform
ContentsBoard(s)
Core ProcessorXtensa®
Interconnect SystemGrove, HY2.0-4P
MfrM5Stack Technology Co., Ltd.
Note-
Operating System-
Platform-
Product StatusActive
Series-
Suggested Programming EnvironmentArduino, MicroPython, UIFlow
TypeMPU
Utilized IC / PartESP32

器件图片

技术资料

该型号暂未收录资料。