Chip Quik Inc.United States
LF SOLDER WIRE 99.3/0.7 TIN/COPP
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Storage/Refrigeration Temperature | - |
| Other | |
| Base Product Number | NC2SW |
| Composition | Sn99.3Cu0.7 (99.3/0.7) |
| Diameter | 0.031" (0.79mm) |
| Flux Type | No-Clean |
| Form | Spool, 1 lb (454 g) |
| Melting Point | 441°F (227°C) |
| Mfr | Chip Quik Inc. |
| Process | Lead Free |
| Product Status | Active |
| Series | - |
| Shelf Life | - |
| Shelf Life Start | - |
| Type | Wire Solder |
| Wire Gauge | 20 AWG, 21 SWG |