All alternatives

View full report

Technical parameters

Environment and package
Inner Dimension0.945" L x 0.945" W (24.00mm x 24.00mm)
Outer Dimension1.950" L x 1.350" W (49.53mm x 34.29mm)
PackageBulk
Thermal Center Pad-
Other
MaterialStainless Steel
MfrChip Quik Inc.
Number of Positions176
Pitch0.020" (0.50mm)
Product StatusActive
SeriesProto-Advantage PA
Thickness0.0040" (0.102mm)
TypeLQFP

Documents