PA0194C

TSSOP-20-EXP-PAD TO DIP-20 SMT A

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技术参数

环境与封装
PackageBulk
Package AcceptedTSSOP
Size / Dimension1.000" L x 0.400" W (25.40mm x 10.16mm)
其他
Board Thickness-
Material-
MfrChip Quik Inc.
Number of Positions20
Pitch0.026" (0.65mm)
Product StatusActive
Proto Board TypeSMD to DIP
SeriesProto-Advantage

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技术资料