SRA Soldering ProductsUnited States
SAC 305 LEAD FREE SOLDER PASTE T
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bag |
| Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
| Other | |
| Base Product Number | SSLFNC |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | - |
| Digi-Key Storage | Refrigerated |
| Flux Type | No-Clean |
| Form | Jar, 8.8 oz (250g) |
| Melting Point | 422 ~ 428°F (217 ~ 220°C) |
| Mesh Type | 3 |
| Mfr | SRA Soldering Products |
| Process | Lead Free |
| Product Status | Active |
| Series | - |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
| Type | Solder Paste |
| Wire Gauge | - |