Chip Quik Inc.United States
HEAT SINK THERMAL COMPOUND
All alternatives
View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Size / Dimension | 1 gram Syringe |
| Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
| Thermal Conductivity | 8.50W/m-K |
| Usable Temperature Range | -40°F ~ 302°F (-40°C ~ 150°C) |
| Other | |
| Color | Gray |
| Digi-Key Storage | - |
| Features | - |
| Material Flammability Rating | - |
| Mfr | Chip Quik Inc. |
| Product Status | Active |
| Series | CHIPQUIK® |
| Shelf Life | 60 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | - |
| Type | Silicone Compound |