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Technical parameters

Environment and package
Flash Size-
Operating Temperature-40°C ~ 100°C (TC)
PackageBulk
Package / Case900-BFBGA, FCBGA
RAM Size3MB
Supplier Device Package900-FCBGA (25x25)
Other
ArchitectureDSP, MPU
ConnectivityEthernet, I²C, PCIe, SPI, UART/USART, USB
Core ProcessorDual ARM® Cortex®-A15 MPCore™ with CoreSight™
MfrTexas Instruments
Number of I/O64
PeripheralsDDR, DMA, PCIe, POR, WDT
Primary Attributes-
Product StatusActive
SeriesKeyStone Multicore
Speed1GHz

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