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Technical parameters

Environment and package
Flash Size-
Operating Temperature-40°C ~ 125°C (TJ)
PackageTape & Reel (TR)
Package / Case367-BFBGA, FCBGA
RAM Size512kB
Supplier Device Package367-FCBGA (15x15)
Other
ArchitectureDSP, MPU
ConnectivityCANbus, Ethernet, I²C, McASP, MMC/SD/SDIO, SPI, UART, USB
Core ProcessorARM® Cortex®-M4, C66x
MfrTexas Instruments
Number of I/O126
PeripheralsDMA, POR, PWM, WDT
Primary Attributes-
Product StatusActive
Series-
Speed212.8MHz, 355MHz

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