Chip Quik Inc.United States
THERMALLY STABLE SOLDER PASTE NO
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) |
| Other | |
| Base Product Number | TS391A |
| Composition | Sn63Pb37 (63/37) |
| Diameter | - |
| Flux Type | No-Clean |
| Form | Syringe, 0.53 oz (15g), 5cc |
| Melting Point | 361°F (183°C) |
| Mesh Type | 4 |
| Mfr | Chip Quik Inc. |
| Process | Leaded |
| Product Status | Active |
| Series | - |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | - |
| Type | Solder Paste |
| Wire Gauge | - |
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