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| 环境与封装 | |
|---|---|
| Package | Spool |
| Storage/Refrigeration Temperature | 50°F ~ 104°F (10°C ~ 40°C) |
| 其他 | |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | 0.062" (1.57mm) |
| Flux Type | Water Soluble |
| Form | Spool, 1 lb (453.59g) |
| Melting Point | 423 ~ 424°F (217 ~ 218°C) |
| Mfr | Canfield Technologies |
| Process | Lead Free |
| Product Status | Active |
| Series | - |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Manufacture |
| Type | Wire Solder |
| Wire Gauge | 14 AWG, 16 SWG |
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