JAE ElectronicsJapan
Interconnect Rectangular
All alternatives
View full reportTechnical parameters
Key specs
Positions60
Rows2
Pitch400 µm
GenderMale
| Environment and package | |
|---|---|
| Height Above Board | 0.020" (0.50mm) |
| Mated Stacking Heights | 0.7mm |
| Mounting Type | Surface Mount |
| Package | Bulk |
| Other | |
| Connector Type | Plug, Outer Shroud Contacts |
| Contact Finish | Gold |
| Contact Finish Thickness | 3.94µin (0.100µm) |
| Features | Solder Retention |
| Mfr | JAE Electronics |
| Number of Positions | 60 |
| Number of Rows | 2 |
| Pitch | 0.016" (0.40mm) |
| Product Status | Active |
| Series | WP7 |