Chip Quik Inc.United States
THERMALLY STABLE SOLDER PASTE WS
All alternatives
View full reportTechnical parameters
| Environment and package | |
|---|---|
| Package | Bulk |
| Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
| Other | |
| Composition | Sn63Pb37 (63/37) |
| Diameter | - |
| Flux Type | Water Soluble |
| Form | Syringe, 1.23 oz (34.869g) |
| Melting Point | 361°F (183°C) |
| Mesh Type | 4 |
| Mfr | Chip Quik Inc. |
| Process | - |
| Product Status | Active |
| Series | CHIPQUIK® |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | - |
| Type | Solder Paste |
| Weight | - |
| Wire Gauge | - |