AMDUnited States
IC VERSALPRIME ACAP FPGA 1760BGA
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View full reportTechnical parameters
| Environment and package | |
|---|---|
| Flash Size | - |
| Operating Temperature | -40°C ~ 110°C (TJ) |
| Package | Tray |
| Package / Case | 1760-BFBGA, FCBGA |
| RAM Size | 256KB |
| Supplier Device Package | 1760-FCBGA (40x40) |
| Other | |
| Architecture | MPU, FPGA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Mfr | AMD |
| Number of I/O | 500 |
| Peripherals | DDR, DMA, PCIe |
| Primary Attributes | Versal™ Prime FPGA, 1M Logic Cells |
| Product Status | Active |
| Series | Versal™ Prime |
| Speed | 400MHz, 1GHz |
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