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Technical parameters

Environment and package
Flash Size-
Operating Temperature0°C ~ 100°C (TJ)
PackageTray
Package / Case784-BFBGA, FCBGA
RAM Size256KB
Supplier Device Package784-FCBGA (23x23)
Other
ArchitectureMCU, FPGA
Base Product NumberXCZU4
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
MfrAMD
Number of I/O252
PeripheralsDMA, WDT
Primary AttributesZynq®UltraScale+™ FPGA, 192K+ Logic Cells
Product StatusActive
SeriesZynq® UltraScale+™ MPSoC EV
Speed533MHz, 600MHz, 1.3GHz

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