WAFER (SAWN) - FRAME
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View full reportTechnical parameters
| Power | |
|---|---|
| Current - Supply | 18 mA |
| Environment and package | |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Package | Tape & Reel (TR) |
| Package / Case | Die |
| Supplier Device Package | Wafer |
| Other | |
| Input Type | Analog, Digital |
| Mfr | Renesas Electronics Corporation |
| Output Type | 1-Wire®, I²C, SPI |
| Product Status | Active |
| Series | - |
| Type | Signal Conditioner |