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Полный отчётТехнические параметры
| Условия эксплуатации и корпус | |
|---|---|
| Package | Jar |
| Storage/Refrigeration Temperature | 37°F~77°F(3°C~25°C) |
| Другое | |
| Base Product Number | SMDLTL |
| Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
| Diameter | - |
| Flux Type | No-Clean |
| Form | Jar, 0.53 oz (15g) |
| Melting Point | 281°F (138°C) |
| Mesh Type | 4 |
| Mfr | Chip Quik Inc. |
| Process | Lead Free |
| Product Status | Active |
| Series | - |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | - |
| Type | Solder Paste, Two Part Mix |
| Wire Gauge | - |