BGA-25 (1MM PITCH, 8X6MM BODY) S
Все аналоги
Полный отчётТехнические параметры
| Условия эксплуатации и корпус | |
|---|---|
| Inner Dimension | 0.315" L x 0.236" W (8.00mm x 6.00mm) |
| Outer Dimension | 1.300" L x 0.900" W (33.02mm x 22.86mm) |
| Package | Bulk |
| Thermal Center Pad | - |
| Другое | |
| Material | Stainless Steel |
| Mfr | Chip Quik Inc. |
| Number of Positions | 25 |
| Pitch | 0.039" (1.00mm) |
| Product Status | Active |
| Series | Proto-Advantage IPC |
| Thickness | 0.0040" (0.102mm) |
| Type | BGA |